Substrate processing apparatus, fluid supply system, and substrate processing method

A fluid supply system for supplying a processing fluid in a supercritical state into a processing container having a processing space configured to accommodate a substrate having a surface wetted with a liquid, the fluid supply system comprising:

• a fluid supply line having one end connected to a fluid supply source and another end connected to the processing container;
• a pump provided in the fluid supply line;
• a heater provided in the fluid supply line at a location on a downstream side of the pump, the heater being configured to heat the processing fluid to generate the processing fluid in the supercritical state;
• a first flow rate adjuster provided in the fluid supply line at a location between the pump and the heater, the first flow rate adjuster being configured to adjust a supply flow rate of the processing fluid supplied into the processing container;
• a first pressure measurement section provided in the fluid supply line at a location between the first flow rate adjuster and the heater, the first pressure measurement section being configured to measure a pressure of the processing fluid;
• a second pressure measurement section provided in the fluid supply line at a location between the pump and the first flow rate adjuster, the second pressure measurement section being configured to measure a pressure of the processing fluid;
• a branch point provided between the pump and the first flow rate adjuster in the fluid supply line;
• a connection point provided on an upstream side of the pump in the fluid supply line;
• a branch line connecting the branch point to the connection point;
• a second flow rate adjuster provided in the branch line and configured to adjust the supply flow rate of the processing fluid supplied into the processing container;
• and
• a controller configured to control the second flow rate adjuster based on a first pressure of the processing fluid in a liquid state measured by the first pressure measurement section and a second pressure of the processing fluid in the liquid state measured by the second pressure measurement section.

A substrate processing method using a substrate processing apparatus including:

• a processing container having a processing space configured to accommodate a substrate having a surface wetted with a liquid;
• and
• a processing fluid supply configured to supply a processing fluid in a supercritical state into the processing container,
• wherein the processing fluid supply includes:
• a fluid supply line having one end connected to a fluid supply source and another end connected to the processing container;
• a pump provided in the fluid supply line;
• a heater provided in the fluid supply line at a location on a downstream side of the pump, the heater being configured to heat the processing fluid to generate the processing fluid in the supercritical state;
• a first flow rate adjuster provided in the fluid supply line at a location between the pump and the heater, the first flow rate adjuster being configured to adjust a supply flow rate of the processing fluid supplied into the processing container;
• a first pressure measurement section provided in the fluid supply line at a location between the first flow rate adjuster and the heater, the first pressure measurement section being configured to measure a pressure of the processing fluid;
• a second pressure measurement section provided in the fluid supply line at a location between the pump and the first flow rate adjuster, the second pressure measurement section being configured to measure a pressure of the processing fluid;
• a branch point provided between the pump and the first flow rate adjuster in the fluid supply line;
• a connection point provided on an upstream side of the pump in the fluid supply line;
• a branch line connecting the branch point to the connection point;
• and
• a second flow rate adjuster provided in the branch line and configured to adjust the supply flow rate of the processing fluid supplied into the processing container,
• the substrate processing method comprising controlling the second flow rate adjuster based on a first pressure of the processing fluid in a liquid state measured by the first pressure measurement section and a second pressure of the processing fluid in the liquid state measured by the second pressure measurement section.