Gas delivery system for a thermal processing apparatus

A thermal processing system for performing rapid thermal processing of semiconductor workpieces, comprising:

• a processing chamber;
• a workpiece support configured to support a workpiece within the processing chamber;
• a heat source configured to heat the workpiece;
• a temperature measurement system configured to generate data indicative of a temperature of the workpiece;
• a gas delivery system configured to flow a process gas over the workpiece supported on the workpiece support, the gas delivery system comprising:
• a cover plate;
• a distribution plate extending axially between a first surface and a second surface, the first and second surfaces extending perpendicular to the axial direction, the distribution plate having a distribution area comprising plurality of holes extending axially therethrough;
• one or more collars coupled axially between the cover plate and the distribution plate, the collar, the cover plate, and the distribution plate together defining an interior chamber;
• and
• a gas supply coupled to the collar to provide process gas from a gas source to the interior chamber,
• wherein a total area of the holes is from about 0.1% to about 0.9% of a total area of the distribution area on the distribution plate.

A method for performing a thermal process, comprising:

• controlling, by one or more controllers, a heat source to begin heating a workpiece supported on a workpiece support in a processing chamber;
• optionally, receiving, by the one or more control devices, data from a temperature measurement system indicative of a temperature of the workpiece;
• optionally, monitoring, by the one or more control devices, the temperature of the workpiece relative to a temperature setpoint;
• controlling, by the one or more controllers, a gas delivery system to supply a process gas to the processing chamber, the gas delivery system comprising:
• a cover plate;
• a distribution plate extending axially between a first surface and a second surface, the first and second surfaces extending perpendicular to the axial direction, the distribution plate having a distribution area comprising plurality of holes extending axially therethrough;
• one or more collars coupled axially between the cover plate and the distribution plate, the collar, the cover plate, and the distribution plate together defining an interior chamber;
• and
• a gas supply coupled to the collar to provide process gas from a gas source to the interior chamber,
• wherein a total area of the holes is from about 0.1% to about 0.9% of a total area of the distribution area on the distribution plate;
• and
• after the thermal process is complete, removing the workpiece from the processing chamber.