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US 2025/0167007 A1Published application
Electronic device with top side pin array and manufacturing method thereof
AssigneeAmkor Technology Singapore Holding Pte. Ltd.
InventorsDevarajan Balaraman, Daniel Richter, Greg Hames, Dean Zehnder, Glenn Rinne
Life of this patent
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Abstract
An electronic device and a manufacturing method thereof. As non-limiting examples, various aspects of this disclosure provide an electronic device having a top side pin array, for example which may be utilized for three-dimensional stacking, and a method for manufacturing such an electronic device.
Claims21
1-20. (canceled)
An electronic device comprising:
- a lower substrate comprising a lower substrate top side and a lower substrate bottom side, wherein the lower substrate top side comprises a conductive portion and a die attach pad;
- a semiconductor die attached and electrically coupled to the die attach pad;
- an upper substrate comprising an upper substrate top side and an upper substrate bottom side, wherein the upper substrate bottom side comprises a conductive portion;
- and
- a pin comprising:
- a pin lower end attached to the conductive portion of the lower substrate top side via a lower solder member;
- and
- a pin upper end attached to the conductive portion of the upper substrate top side via an upper solder member.
5 more elements
An electronic device, comprising:
- a lower substrate comprising a lower substrate top side and a lower substrate bottom side, wherein the lower substrate comprise a laminate substrate;
- a upper substrate comprising an upper substrate top side and a upper substrate bottom side, wherein the upper substrate comprise a coreless substrate;
- a semiconductor die comprising a die active side and a die back side, wherein the semiconductor die is position between the lower substrate top side and the upper substrate bottom side;
- a conductive pin comprising a pin upper end, a pin lower end, and a pin lateral side between the pin upper end and the pin lower end, wherein the pin lower end is coupled to the lower substrate top side, and wherein the pin upper end is coupled to the upper substrate bottom side;
- and
- external interconnection structures along the lower substrate bottom side.
3 more elements
A method of manufacturing an electronic device, the method comprising:
- providing a lower substrate comprising a lower substrate top side and a lower substrate bottom side, wherein the lower substrate top side comprises a conductive portion and a die attach pad;
- providing a semiconductor die attached and electrically coupled to the die attach pad;
- providing an upper substrate comprising an upper substrate top side and an upper substrate bottom side, wherein the upper substrate bottom side comprises a conductive portion;
- and
- providing a pin comprising a pin lower end attached to the conductive portion of the lower substrate top side via a lower solder member and a pin upper end attached to the conductive portion of the upper substrate top side via an upper solder member.
2 more elements
Dependencies are inferred from the claim text.