EMBEDDED COMPONENT INTERPOSER OR SUBSTRATE COMPRISING DISPLACEMENT COMPENSATION TRACES (DCTs) AND METHOD OF MAKING THE SAME

A method of making a substrate comprising an embedded component and further comprising a region of displacement compensation traces (DCTs), the method of making the substrate comprising:

• providing a component comprising conductive contacts;
• measuring a shift of the component;
• forming a plurality of interconnect pads formed in an interconnect pad region over the component according to a nominal design position;
• and
• forming the region of DCTs comprising at least one arrangement of DCTs with unit specific patterning such that the arrangement of DCTs is coupled to, and extends between, the conductive contacts and the interconnect pads, wherein the arrangement of DCTs:
• compensates for the measured shift of the component, and
• comprises traces on one or more vertically separated RDL layers that extend between two termini and a majority of the traces comprise distances between the termini of the DCT traces that is less than an interconnect pad pitch.