Multilayer electronic component

A multilayer electronic component comprising:

• a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer in a first direction, the body including a first surface and a second surface opposing each other in the first direction, a third surface and a fourth surface, connected to the first and second surfaces and opposing each other in a second direction, and a fifth surface and a sixth surface, connected to the first to fourth surfaces and opposing each other in a third direction;
• a first external electrode including a first connection portion disposed on the third surface, and a first band portion extending from the first connection portion onto a portion of the first surface and a portion of the second surface;
• and
• a second external electrode including a second connection portion disposed on the fourth surface, and a second band portion extending from the second connection portion onto a portion of the first surface and a portion of the second surface,
• wherein the first external electrode includes a first electrode layer connected to the first internal electrode, and a first conductive resin layer disposed on the first electrode layer in the first band portion, the first conductive resin layer including a second conductive metal and a thermosetting resin,
• the second external electrode includes a second electrode layer connected to the second internal electrode, and a second conductive resin layer disposed on the second electrode layer in the second band portion, the second conductive resin layer including the second conductive metal and the thermosetting resin,
• the first electrode layer and the second electrode layer include a first conductive metal and glass,
• the first conductive resin layer is not disposed on the first connection portion, and
• the second conductive resin layer is not disposed on the second connection portion.