Multilayer electronic component

A multilayer electronic component, comprising:

• a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer;
• an interfacial plating layer disposed at one end of the internal electrode, which is closer to an outer surface of the body;
• and
• an external electrode disposed to cover the interfacial plating layer and a portion of the outer surface of the body on which the interfacial plating layer is not disposed, and including an electrode layer including glass containing Si and Al and a conductive metal,
• wherein the electrode layer includes an inner region adjacent to the interfacial plating layer and an outer region disposed on the inner region, and an area fraction of the glass included in the inner region is higher than an area fraction of the glass included in the outer region.