Multilayer electronic component

A multilayer electronic component, comprising:

• a body including a first surface and a second surface opposing each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposing each other in a second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposing each other in a third direction, and including a first internal electrode layer including a first dielectric layer, and a first internal electrode and a first auxiliary electrode spaced apart from each other in the second direction on the first dielectric layer, and a second internal electrode layer including a second dielectric layer, and a second internal electrode and a second auxiliary electrode spaced apart from each other in the second direction on the second dielectric layer, wherein the first internal electrode layer and the second internal electrode layer are disposed alternately in the first direction;
• first and second external electrodes disposed on the body and connected to the first and second internal electrodes, respectively;
• a first via electrode penetrating the first dielectric layer and connecting the first internal electrode to the second auxiliary electrode;
• a second via electrode penetrating the first dielectric layer and connecting the first auxiliary electrode to the second internal electrode;
• a third via electrode penetrating the second dielectric layer and connecting the second auxiliary electrode to the first internal electrode;
• and
• a fourth via electrode penetrating the second dielectric layer and connecting the second internal electrode to the first auxiliary electrode,
• wherein the first via electrode is shifted from the third via electrode adjacent thereto in the first direction, and the second via electrode is shifted from the fourth via electrode adjacent thereto in the first direction.

A method of manufacturing a multilayer electronic component, the method comprising:

• forming a via in a continuously supplied dielectric sheet;
• filling the via with electrode paste;
• printing an internal electrode pattern connected to the via on the dielectric sheet;
• forming a laminate by laminating the dielectric sheet on which the internal electrode pattern is printed;
• obtaining a unit laminate by cutting the laminate;
• obtaining a body by sintering the unit laminate;
• and
• forming an external electrode on the body.

A multilayer electronic component, comprising:

• a body including:
• a capacitance forming portion comprising:
• first internal electrodes extending in a length-width plane,
• second internal electrodes extending in the length-width plane and overlapping the first internal electrodes in a thickness direction, and
• dielectric layers disposed between the first and second internal electrodes adjacent to each other;
• and
• a margin portion comprising:
• a first margin region wherein the dielectric layers are disposed between the first internal electrodes in the thickness direction without having second internal electrodes disposed between, and
• a second margin region wherein the dielectric layers are disposed between the second internal electrodes in the thickness direction without having first internal electrodes disposed therebetween;
• and
• first via electrodes extending in the thickness direction and disposed in the first margin region, connecting adjacent first internal electrodes in the thickness direction.