Multilayer electronic component and board having multilayer electronic component mounted thereon

A board having a multilayer electronic component mounted thereon, the board comprising:

• a printed circuit board;
• a multilayer electronic component disposed on the printed circuit board;
• and
• a solder ball disposed on the printed circuit board, the solder ball surrounding the multilayer electronic component,
• wherein the multilayer electronic component includes:
• a body including a dielectric layer and an internal electrode disposed alternately with the dielectric layer in a first direction, the body having first and second surfaces opposing each other in the first direction, third and fourth surfaces opposing each other in a second direction, crossing the first direction, and fifth and sixth surfaces opposing each other in a third direction, crossing the first and second directions, the body having a first edge surface connected to the first to third and fifth surfaces, a second edge surface connected to the first, second, fourth and fifth surfaces, a third edge surface connected to the first, second, fourth and sixth surfaces and opposing the first edge surface, and a fourth edge surface connected to the first, second, third and sixth surfaces and opposing the second edge surface;
• and
• an external electrode disposed on the body,
• the internal electrode includes a first internal electrode in contact with the first and third edge surfaces, and a second internal electrode in contact with the second and fourth edge surfaces, and
• the external electrode includes first and third external electrodes respectively disposed on the first and third edge surfaces to be in contact with the first internal electrode, and second and fourth external electrodes respectively disposed on the second and fourth edge surfaces to be in contact with the second internal electrode.