Fingerprint sensor package and fingerprint authentication card including the same

A fingerprint sensor package comprising:

• a substrate including an insulating layer and a wiring layer;
• a fingerprint sensor chip on the substrate;
• a first molding material on the substrate at least partially covering the fingerprint sensor chip and including a first region and a second region surrounding the first region;
• and
• a second molding material on a side surface of the first region of the first molding material and an upper surface of the second region of the first molding material,
• wherein the wiring layer includes a wiring pattern extending outwardly from an inside to an outside of the first molding material,
• wherein a vertical level of the upper surface of the second region of the first molding material is lower than a vertical level of an upper surface of the first region of the first molding material, and
• wherein an elastic modulus of the second molding material is less than an elastic modulus of the first molding material.

A fingerprint authentication card comprising:

• a card body having a groove;
• and
• a fingerprint sensor package in the groove,
• wherein the fingerprint sensor package includes:
• a substrate including an insulating layer and a wiring layer;
• a fingerprint sensor chip on the substrate;
• a molding material on the substrate and on the fingerprint sensor chip and including a first region and a second region surrounding the first region;
• and
• a buffer member between the second region of the molding material and the card body,
• wherein the wiring layer includes a wiring pattern extending outwardly from an inside to an outside of the molding material,
• wherein a vertical level of an upper surface of the second region of the molding material is lower than a vertical level of an upper surface of the first region of the molding material,
• wherein the fingerprint sensor package is in the groove so that the molding material faces the card body.