Microcontroller chip
AssigneeGigadevice Semiconductor Inc.
InventorsYang GAO, Yingwu ZHANG
Life of this patent
Estimating the term…
Loading patent…
AssigneeGigadevice Semiconductor Inc.
InventorsYang GAO, Yingwu ZHANG
Estimating the term…
The present invention provides an MCU chip composed of an MCU die and two or more flash memory dies stacked and packaged with the MCU die. In order to update firmware by means of an OTA upgrade, an OTA upgrade version of the firmware may be programmed into a second flash memory die, and an older version of the firmware may be stored in a first flash memory die. In this way, programming the OTA upgrade version of the firmware into the second flash memory die does not affect any operation in the first flash memory die, allowing RWW operations in the MCU chip. As a result, the influence of erase and program operations in the flash memory dies on operating efficiency of the firmware is greatly reduced, resulting in increases in operating performance, operating efficiency, support to OTA upgrades and upgrading efficiency of the MCU chip.
A microprocessor unit (MCU) chip, comprising, packaged in a single package,
Dependencies are inferred from the claim text.