Fingerprint sensor package and smart card including the same

A fingerprint sensor package comprising:

• a first substrate including a core insulating layer including a first surface and a second surface opposite to the first surface, a ground bezel on the first surface of the core insulating layer, an adhesive layer between the core insulating layer and the ground bezel, first bonding pads on the second surface of the core insulating layer, and an external connection pad between an edge of the second surface of the core insulating layer and the first bonding pads;
• a second substrate attached to the second surface of the core insulating layer, the second substrate including a plurality of first sensing patterns, a plurality of second sensing patterns, and second bonding pads, the plurality of first sensing patterns being apart from each other in a first direction and each extending in a second direction that crosses the first direction, and the plurality of second sensing patterns being apart from each other in the second direction and each extending in the first direction;
• conductive wires electrically connecting the first bonding pads to the second bonding pads;
• a controller chip connected to the second substrate;
• and
• a molding layer covering the second substrate and the controller chip and in contact with the first bonding pads, the second bonding pads, and the conductive wires,
• wherein the molding layer laterally extends on the second surface of the core insulating layer from a side surface of the second substrate to a boundary between the first bonding pads and the external connection pad,
• the plurality of first sensing patterns are apart from the plurality of second sensing patterns in a third direction that is perpendicular to the first direction and the second direction, the plurality of first sensing patterns and the plurality of second sensing patterns form a plurality of capacitors, and
• the external connection pad includes an outer pattern and an inner pattern and is in contact with an anisotropic conductive film including a conductive ball.

A smart card comprising:

• a card body including a groove portion and a connection pad;
• a security chip in the card body;
• and
• a fingerprint sensor package configured to sense a user's fingerprint and transmit a signal corresponding to a sensing result to the security chip,
• wherein the fingerprint sensor package includes,
• a first substrate including a core insulating layer including a first surface and a second surface opposite to the first surface, first bonding pads on the second surface of the core insulating layer, and an external connection pad bonded to the connection pad of the card body,
• a second substrate attached to the second surface of the core insulating layer, the second substrate including a plurality of first sensing patterns, a plurality of second sensing patterns, and second bonding pads, the plurality of first sensing patterns being apart from each other in a first direction and each extending in a second direction that crosses the first direction, and the plurality of second sensing patterns being apart from each other in the second direction and each extending in the first direction,
• conductive wires extending between the first bonding pads and the second bonding pads,
• a controller chip connected to the second substrate, and
• a molding layer covering the second substrate and the controller chip and in contact with the first bonding pads, the second bonding pads, and the conductive wires, and
• wherein the external connection pad includes an outer pattern and an inner pattern and is in contact with an anisotropic conductive film including a conductive ball.