Image pickup unit, endoscope, and method for manufacturing image pickup unit

An endoscope comprising:

• an image pickup unit disposed in a distal end portion of an insertion portion,
• the image pickup unit including:
• a circuit board including:
• a first surface;
• a first side surface and a second side surface both intersecting the first surface;
• a depression including a first wall surface and a second wall surface, the depression dividing the first surface into a plurality of surfaces;
• a plurality of electronic components accommodated in the depression;
• and
• a first resin disposed in the depression, wherein
• the plurality of electronic components comprises a first electronic component disposed closest to the first side surface,
• a first distance between the first electronic component and the first wall surface, and
• the first distance is greater than a second distance between each of the plurality of electronic components other than the first electronic component and whichever wall surface is closer between the respective first wall surface and the second wall surface.

A method for manufacturing an image pickup unit comprises:

• fabricating a semiconductor package including a sensor configured to pick up an image, a planar circuit board, and a circuit board including a first side surface and a second side surface, both the first side surface and the second side surface intersecting the planar circuit board, the circuit board including a depression including a first wall surface and a second wall surface;
• bonding a plurality of electronic components to the planar circuit board,
• a first distance between a first electronic component among the plurality of electronic components disposed closest to the first side surface and the first wall surface being greater than a second distance between each of the plurality of electronic components other than the first electronic component and whichever wall surface is closer between the respective first wall surface and the second wall surface;
• electrically connecting the semiconductor package to the planar circuit board;
• electrically connecting the planar circuit board to the circuit board;
• injecting resin between the first electronic component and the first wall surface;
• and
• curing the resin.