Laser module and systems using the same

A laser module comprising:

• an interposer comprising a plurality of electrical contact pads;
• a semiconductor laser die comprising one or more electrical contact pads each electrically connected to a corresponding electrical contact pad on the interposer;
• and
• a photonic integrated circuit (PIC) flip-chip mounted on a surface of the interposer, the PIC being spaced apart from the semiconductor laser die, the PIC comprising an in-coupling port arranged to receive light emitted from the semiconductor laser die at an edge of the PIC during operation of the laser module.

A method comprising:

• etching a surface of an interposer to define a recessed portion and a planar portion in the surface of the interposer;
• aligning a semiconductor laser assembly comprising a semiconductor laser die relative to the recessed portion;
• flip-chip mounting the semiconductor laser assembly on the interposer, the flip-chip mounting comprising bonding one or more first electrical contact pads on a surface of the semiconductor laser assembly to corresponding electrical contact pads on the planar portion of the interposer, with the semiconductor laser die at least partially extending into a recess defined by the recessed portion;
• and
• flip-chip mounting a photonic integrated circuit (PIC) on the interposer, the flip-chip mounting comprising bonding one or more electrical contact pads on a surface of the PIC to corresponding electrical contact pads on the planar portion of the interposer, the PIC being spaced from the semiconductor laser assembly and aligned to receive a laser beam emitted from the laser assembly.