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AssigneeAvago Technologies International Sales Pte. Limited
InventorsDavid John Kenneth Meadowcroft, Seng-Kum Chan, Han Peng Goh, Gary Fong Kem Goon, Sheng Zhang, Jack YuChieh Chung
Estimating the term…
Novel tools and techniques are provided for implementing a semiconductor package or a chip package, and more particularly methods, systems, and apparatuses are provided for implementing a semiconductor package or a chip package including an optical package or co-packaged optics package comprising a lid. In an embodiment, an optical package can include a first substrate, a first circuit coupled to the first substrate and configured to transmit or receive an electrical signal, a second circuit coupled to the first substrate and configured to transmit or receive an optical signal, and a lid configured to couple to the first substrate and configured to cover at least a portion of the first circuit or the second circuit.
An optical package comprising:
An optical system comprising:
A lid for an optical package, the lid comprising:
Dependencies are inferred from the claim text.