Optical package structure, package structure, and method for forming optical package structure

A package structure, comprising:

• an optical package structure comprising:
• a photonic integrated circuit die comprising a coupler;
• an electronic integrated circuit die bonded to a first region of the photonic integrated circuit die;
• an oxide layer formed over a second region of the photonic integrated circuit die and adjacent to the electronic integrated circuit die;
• and
• a silicon carrier comprising a trench exposing a top surface of the oxide layer and formed directly over the coupler.

A method for forming an optical package structure, comprising:

• forming a photonic integrated circuit die;
• forming an electronic integrated circuit die over the photonic integrated circuit die;
• forming an oxide layer adjacent to the electronic integrated circuit die, wherein a top surface of the oxide layer is substantially level with a top surface of the electronic integrated circuit die;
• attaching a silicon carrier to the electronic integrated circuit die and the oxide layer;
• and
• forming a trench in the silicon carrier, so that part of the top surface of the oxide layer is exposed.