US 2025/0164642 A1Published application

Time-of-flight system and method

AssigneeSony Semiconductor Solutions Corporation

InventorManuel AMAYA BENITEZ

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Abstract

A multi-sensing pixel array that comprises, within a multi-layer stacked die, sensing pixels (PIX_R, PIX_G, PIX_B, PIX_D) and an active illumination (PIX_I).

Claims19

Dependent claims

A multi-sensing pixel array that comprises, within a multi-layer stacked die, sensing pixels and an active illumination.

Dependencies are inferred from the claim text.

Facts

Application: 18/842,415Filed 28 Feb 2023
Priority: EP 22163262.321 Mar 2022
Published: 22 May 2025
Term ends: Not estimatedThe source records don’t support an estimate.

Classification10 codes

G01S 7/4815
Of transmitters alone: using multiple transmitters
G01S 17/894
For mapping or imaging: three-dimensional [3D] imaging with simultaneous measurement of time-of-flight at a two-dimensional [2D] array of receiver…
G01S 7/4811
Constructional features, e.g. arrangements of optical elements: common to transmitter and receiver
G01S 7/4814
Constructional features, e.g. arrangements of optical elements: of transmitters alone

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