Method and device of manufacturing semiconductor device
AssigneeDenso Corporation
InventorsTomoo MORINO, Masayuki IWATSUKI
Life of this patent
Estimating the term…
Loading patent…
AssigneeDenso Corporation
InventorsTomoo MORINO, Masayuki IWATSUKI
Estimating the term…
A method of manufacturing a semiconductor device includes: using a semiconductor element to be inspected as a first semiconductor element; using a semiconductor element for obtaining teaching data as a second semiconductor element; obtaining teaching data including a plurality of data related to characteristics of the second semiconductor element; creating a trained model using the teaching data; and determining whether to perform electric test of the first semiconductor element based on an output obtained by inputting a plurality of data related to characteristics of the first semiconductor element into the trained model.
A method of manufacturing a semiconductor device comprising:
A device of manufacturing a semiconductor device comprising:
Dependencies are inferred from the claim text.