Current sensor integrated circuit
AssigneeAllegro MicroSystems, LLC
InventorsMaxwell McNally, Alexander Latham, Shixi Louis Liu, William P. Taylor
Life of this patent
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Abstract
Methods and apparatus for a current sensor integrated circuit package that includes a die having a first magnetic field sensing element and a leadframe to support the die. The leadframe has a U-shaped current conductor loop with a throat region and a first notch in the throat region of the current conductor loop. A first magnetic field sensing element is positioned in relation to the first notch. In some embodiments, the first magnetic field sensing element is aligned with an edge of the first notch.
Claims34
A current sensor integrated circuit package comprising:
- a die having a first magnetic field sensing element;
- a leadframe to support the die, the leadframe having a U-shaped current conductor loop with a throat region and a first notch in the throat region of the current conductor loop;
- and
- a first magnetic field sensing element positioned in relation to the first notch.
A method, comprising:
- employing a die having a first magnetic field sensing element in a current sensor integrated circuit package;
- supporting a leadframe with the die, the leadframe having a U-shaped current conductor loop with a throat region and a first notch in the throat region of the current conductor loop;
- and
- positioning a first magnetic field sensing element in relation to the first notch.
Dependencies are inferred from the claim text.