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US 2025/0164296 A1Published application
Miniature sensor cavities
OwnerSreenivasan Kalyani KODURI, Christopher Daniel MANACK +1inventors
InventorsSreenivasan Kalyani KODURI, Christopher Daniel MANACK, Leslie Edward STARK
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Abstract
In examples, a sensor package includes a semiconductor die, a sensor on the semiconductor die, and a ring encircling the sensor. The sensor and an inner surface of the ring are exposed to an exterior environment of the sensor package. The sensor package includes a mold compound covering the semiconductor die and abutting an outer surface of the ring.
Claims23
A method, comprising:
- providing a semiconductor die having a sensor;
- positioning a ring encircling the sensor;
- positioning the semiconductor die and the ring in a mold chase, a film between the ring and a member of the mold chase;
- and
- covering the semiconductor die with a mold compound, the ring precluding the mold compound from covering the sensor.
2 more elements
A method, comprising:
- providing a semiconductor die having a sensor;
- covering the sensor with a solid member, the solid member mechanically coupled to the sensor;
- positioning the semiconductor die and the solid member in a mold chase;
- covering the semiconductor die with a mold compound, the solid member precluding the mold compound from covering the sensor;
- and
- decoupling the solid member from the sensor to form a cavity in the mold compound, the sensor in the cavity.
3 more elements
Dependencies are inferred from the claim text.