Method of manufacturing a superconductive integrated circuit

A method of manufacturing a superconductive integrated circuit on a substrate, the method comprising:

• depositing a first superconductive layer of a first superconductive material over the substrate;
• structuring the first superconductive layer to form a structured first superconductive layer, the structured first superconductive layer including a plurality of structures of the first superconductive material, and the plurality of structures of the first superconductive material being electrically and/or structurally disconnected from each other;
• forming a Josephson Junction (JJ) layer stack including a JJ barrier layer over the first superconductive layer, the JJ layer stack comprising a continuous, unstructured layer stack;
• structuring the JJ layer stack to form a JJ structure;
• forming a dielectric cover layer over the JJ structure;
• structuring the dielectric cover layer a first time to expose an upper side of the JJ structure;
• forming a second superconductive layer of a second superconductive material over the dielectric cover layer;
• and
• structuring the second superconductive layer to form a structured second superconductive layer.