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US 2025/0160085 A1Published application
Electronic device
AssigneeInnolux Corporation
InventorMing-Chang LIN
Life of this patent
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Abstract
An electronic device is provided by the present disclosure. The electronic device includes a substrate, an electronic component, and a bonding structure. The bonding structure is disposed between the electronic component and the substrate, and the bonding structure includes at least a first bonding layer and at least one compressible layer.
Claims6
An electronic device, comprising:
- a substrate;
- an electronic component;
- and
- a bonding structure disposed between the electronic component and the substrate, wherein the bonding structure comprises a first bonding layer and at least one compressible layer.
1 more element
Dependencies are inferred from the claim text.