Semiconductor light emitting device and method of manufacturing the same
AssigneeStanley Electric Co., Ltd.
InventorJi-Hao LIANG
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AssigneeStanley Electric Co., Ltd.
InventorJi-Hao LIANG
Estimating the term…
Provided is a semiconductor light emitting device capable of performing bonding of a phosphor plate and a light emitting element in the atmosphere by surface activated bonding. A semiconductor light emitting device includes a light emitting element including a semiconductor light emitting layer, and a phosphor plate bonded to the light emitting element. A buffer layer formed of a dielectric that transmits light emitted by the light emitting element is disposed between the light emitting element and the phosphor plate. The light emitting element and the phosphor plate are bonded with the buffer layer interposed therebetween. The buffer layer is amorphous.
A semiconductor light emitting device comprising:
A method of manufacturing a semiconductor light emitting device in which a phosphor plate that absorbs light emitted from a semiconductor light emitting layer and generating fluorescent light is bonded to a light emitting element including the semiconductor light emitting layer, the method comprising:
Dependencies are inferred from the claim text.