Electronic device package and fabricating method thereof

An electronic device comprising:

• a signal distribution structure comprising a conductor and a dielectric material, the conductor having a first side oriented in a first direction and a second side oriented in a second direction opposite the first direction, the dielectric material covering the second side of the conductor, the dielectric material forming a first exterior side of the electronic device facing the second direction;
• a semiconductor die comprising a first die side, a second die side opposite the first die side, and lateral die sides between the first die side and the second die side, wherein the first die side comprises a sensor and a bond pad facing the first direction;
• an encapsulant that laterally covers the lateral die sides, wherein the encapsulant comprises a first encapsulant side, a second encapsulant side, and a lateral encapsulant side between the first encapsulant side and the second encapsulant side;
• an interconnect structure passing through the encapsulant, wherein the interconnect structure is electrically coupled to the bond pad and the conductor;
• a protection structure over the first die side and spaced apart from the first die side, wherein the protection structure forms a second exterior side of the electronic device facing the first direction, opposite the first exterior side, with no conductive material exposed at the second exterior side;
• and
• an insulating material between the protection structure and the first die side.

An electronic device comprising:

• a signal distribution structure comprising a conductor and a dielectric material laterally surrounding the conductor, the signal distribution structure having a first side forming a first exterior side of the electronic device and a second side opposite the first side;
• a semiconductor die comprising a first die side, a second die side opposite the first die side, and lateral die sides between the first die side and the second die side, wherein the first die side comprises a sensor and a bond pad;
• an interconnect structure electrically coupling the bond pad and the conductor;
• an encapsulant that laterally covers the lateral die sides and the interconnect structure, wherein the encapsulant comprises a first encapsulant side, a second encapsulant side, and a lateral encapsulant side between the first encapsulant side and the second encapsulant side;
• and
• a protection structure over the first die side, the protection structure spaced apart from the first die side, wherein the protection structure forms a second exterior side of the electronic device, opposite the first exterior side, with no conductive material exposed at the second exterior side.

A method of manufacturing an electronic device, the method comprising:

• providing a signal distribution structure comprising a conductor and a dielectric material, the conductor having a first side oriented in a first direction and a second side oriented in a second direction opposite the first direction, the dielectric material covering the second side of the conductor, the dielectric material forming a first exterior side of the electronic device facing the second direction;
• providing a semiconductor die comprising a first die side, a second die side opposite the first die side, and lateral die sides between the first die side and the second die side, wherein the first die side comprises a sensor and a bond pad facing the first direction;
• electrically coupling the bond pad and the conductor with an interconnect structure;
• providing an encapsulant that laterally covers the lateral die sides and the interconnect structure, wherein the encapsulant comprises a first encapsulant side, a second encapsulant side, and a lateral encapsulant side between the first encapsulant side and the second encapsulant side;
• providing an insulating material over the first die side;
• and
• providing a protection structure over the insulating material and the first die side, the protection structure spaced apart from the first die side, wherein the protection structure forms a second exterior side of the electronic device facing the first direction, opposite the first exterior side, with no conductive material exposed at the second exterior side.