Semiconductor package structure and related methods

A method of forming a semiconductor package, the method comprising:

• coupling a die to a substrate;
• applying a first molding compound to the substrate and the die, the first molding compound comprising one or more shelves;
• coupling a glass lid over the die and on the one or more shelves;
• and
• applying a second molding compound on an edge of the first molding compound, the second molding compound coupled over an outer surface of the glass lid opposite an inner surface of the glass lid facing the die;
• wherein the die is an image sensor die.

A method of forming a semiconductor package, the method comprising:

• coupling a die to a substrate;
• applying a first molding compound to the substrate and the die, the first molding compound comprising one or more shelves and a recess;
• coupling a glass lid over the die, on the one or more shelves, and within the recess of the first molding compound;
• and
• coupling a second molding compound to the first molding compound;
• wherein both the first molding compound and the second molding compound are directly coupled to a same sidewall of the glass lid.