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US 2025/0160013 A1Published application
Semiconductor device and electronic device
AssigneeSony Semiconductor Solutions Corporation
InventorsKOJI TSUCHIYA, HIROKAZU NAKAYAMA
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AssigneeSony Semiconductor Solutions Corporation
InventorsKOJI TSUCHIYA, HIROKAZU NAKAYAMA
Estimating the term…
The present disclosure relates to a semiconductor device that makes a cover member easy to remove without leaving, with the cover member removed from a package main body portion, an adhesive for fixing the cover member on a support surface of the package main body portion that supports the cover member. The semiconductor device includes a semiconductor element, a package main body portion including a substrate portion on which the semiconductor element is installed and a frame portion that is provided on the substrate portion so as to surround the semiconductor element and has an opening portion formed on an upper side, and a cover member that closes the opening portion with the cover member supported by a support surface forming an opening end surface of the opening portion of the package main body portion. The cover member includes an overhanging portion that sticks out over an outline of the support surface in plan view and is provided with the overhanging portion fixed to the frame portion.
A semiconductor device comprising:
An electronic device comprising a semiconductor device, the semiconductor device including:
An electronic device comprising a semiconductor device, the semiconductor device including:
Dependencies are inferred from the claim text.