Semiconductor device, electronic device, and manufacturing method for semiconductor device

A semiconductor device comprising:

• a substrate;
• a semiconductor element that is provided on the substrate;
• a connection member that electrically connects the substrate and the semiconductor element;
• a transparent member that is provided on an opposite side to a side of the substrate with respect to the semiconductor element;
• and
• a sealing resin portion that supports the transparent member with respect to the substrate, seals surroundings between the substrate and the transparent member, and forms a cavity between the semiconductor element and the transparent member together with the semiconductor element and the transparent member, wherein the resin sealing resin portion covers a side surface of the semiconductor element and a connection portion of the connection member with respect to the substrate, and exposes an entire front side of the semiconductor element that accepts connection of one end side of the connection member.

An electronic device comprising a semiconductor device that includes:

• a substrate;
• a semiconductor element that is provided on the substrate;
• a connection member that electrically connects the substrate and the semiconductor element;
• a transparent member that is provided on an opposite side to a side of the substrate with respect to the semiconductor element;
• and
• a sealing resin portion that supports the transparent member with respect to the substrate, seals surroundings between the substrate and the transparent member, and forms a cavity between the semiconductor element and the transparent member together with the semiconductor element and the transparent member, wherein the semiconductor element includes, on a front side, a resin restriction portion that restricts intrusion of a resin material for forming the sealing resin portion into an inside of the semiconductor element.

An electronic device comprising a semiconductor device that includes:

• a substrate;
• a semiconductor element that is provided on the substrate;
• a connection member that electrically connects the substrate and the semiconductor element;
• a transparent member that is provided on an opposite side to a side of the substrate with respect to the semiconductor element;
• and
• a sealing resin portion that supports the transparent member with respect to the substrate, seals surroundings between the substrate and the transparent member, and forms a cavity between the semiconductor element and the transparent member together with the semiconductor element and the transparent member, wherein the sealing resin portion covers a side surface of the semiconductor element and a connection portion of the connection member with respect to the substrate, and exposes an entire front side of the semiconductor element that accepts connection of one end side of the connection member.

A manufacturing method for a semiconductor device, the method comprising:

• providing a semiconductor element on a substrate;
• providing a connection member that electrically connects the substrate and the semiconductor element;
• applying a sealing resin material around the semiconductor element on the substrate so as to cover at least a side surface of the semiconductor element and a connection portion of the connection member with respect to the substrate;
• mounting, on the sealing resin material, a transparent member located above the semiconductor element;
• and
• curing the sealing resin material.