FINFET Gate Structure and Related Methods
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsCheng-Ting Chung, Ching-Wei Tsai, Kuan-Lun Cheng
Life of this patent
Estimating the term…
Loading patent…
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsCheng-Ting Chung, Ching-Wei Tsai, Kuan-Lun Cheng
Estimating the term…
A semiconductor device includes a substrate having a fin element extending therefrom. In some embodiments, a gate structure is formed over the fin element, where the gate structure includes a dielectric layer on the fin element, a metal capping layer disposed over the dielectric layer, and a metal electrode formed over the metal capping layer. In some cases, first sidewall spacers are formed on opposing sidewalls of the metal capping layer and the metal electrode. In various embodiments, the dielectric layer extends laterally underneath the first sidewall spacers to form a dielectric footing region.
A semiconductor device, comprising:
A device, comprising:
A semiconductor device, comprising:
Dependencies are inferred from the claim text.