Integrated circuit devices with angled transistors

An integrated circuit (IC) device, comprising:

• a support structure;
• a plurality of angled structures over the support structure, where an individual angled structure of the plurality of angled structures includes a semiconductor material and has a longitudinal axis that is substantially parallel to the support structure and is at an angle between 10 degrees and 80 degrees with respect to an edge of the support structure;
• a plurality of IC components based on the plurality of angled structures, the plurality of IC components having a plurality of terminals;
• and
• an array of stacked via pairs, comprising a first stacked via pair, a second stacked via pair, and a third stacked via pair, each stacked via pair including:
• a first via electrically coupled to a different one of the terminals, and
• a second via stacked above and electrically coupled to the first via,
• wherein an overlap between the first via and the second via for the first stacked via pair is larger than the overlap for the second stacked via pair and the overlap for the third stacked via pair, and wherein the second stacked via pair and the third stacked via pair are on opposite sides of the first stacked via pair.