Heat dissipation device
AssigneeNational Tsing Hua University
InventorShwin-Chung Wong
Life of this patent
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Abstract
A heat dissipation device is adapted for dissipating heat from a heat source, and includes a vaper chamber, a heat pipe set and a heat dissipation fin set. The vapor chamber is adapted for thermal coupling to the heat source. The heat pipe set is adapted for thermal coupling to the heat source, the heat from the heat source is synchronously conducted to the vapor chamber and the heat pipe set. The vapor chamber is thermally coupled to the heat dissipation fin set, and the heat pipe set penetrates through the heat dissipation fin set.
Claims15
A heat dissipation device, adapted to dissipate heat of a heat source, and comprising:
- a vaper chamber, adapted for thermal coupling to the heat source;
- a heat pipe set, adapted for thermal coupling to the heat source, wherein heat from the heat source is synchronously conducted to the vapor chamber and the heat pipe set;
- and
- a heat dissipation fin set, wherein the vapor chamber is thermally coupled to the heat dissipation fin set, and the heat pipe set penetrates through the heat dissipation fin set.
Dependencies are inferred from the claim text.