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US 2025/0159802 A1Published application
Printed circuit board and manufacturing method thereof
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsYangje Lee, Changgon Kim, Eunsik Kim, Jesang Park, Youngil Cho, Sumin Seo, Gyeongah Yun, Sangwuk Jun
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Abstract
A printed circuit board includes: insulating layers; a cavity disposed in the insulating layers; contact portions disposed in the cavity; and a dummy layer disposed on a bottom portion of a side wall of the cavity and disposed between the insulating layers. A first thickness of the dummy layer is less than a second thickness of the contact portions.
Claims20
A printed circuit board comprising:
- insulating layers;
- a cavity disposed in at least a portion of the insulating layers;
- contact portions disposed in the cavity;
- and
- a dummy layer disposed on a bottom portion of a side wall of the cavity and disposed between the insulating layers,
- wherein a first thickness of the dummy layer is less than a second thickness of the contact portions.
3 more elements
A method for manufacturing a printed circuit board, the method comprising:
- forming contact portions on a first insulating layer;
- forming a blocking layer on the contact portions;
- forming insulating layers having a cavity for exposing the blocking layer and covering an edge of the blocking layer;
- forming a sacrificial layer on the blocking layer in the cavity;
- removing the sacrificial layer;
- and
- forming a dummy layer disposed on a bottom portion of a side wall of the cavity and disposed below the insulating layers by removing the blocking layer exposed by the cavity.
4 more elements
Dependencies are inferred from the claim text.