Packaged module with front end integrated circuit and stacked filter assembly

A wireless communication device comprising:

• a package substrate;
• a front end integrated circuit supported by the package substrate, the front end integrated circuit including an amplifier configured to amplify a radio frequency signal;
• an antenna;
• and
• a stacked filter assembly supported by the package substrate, the stacked filter assembly coupled in a signal path between the front end integrated circuit and the antenna, the stacked filter assembly including a first surface mount device and a second surface mount device, and the second surface mount device stacked over at least part of the first surface mount device.

A system board assembly comprising:

• a system board;
• a packaged module on the system board, the packaged module including a package substrate;
• a front end integrated circuit supported by the package substrate, the front end integrated circuit including an amplifier configured to amplify a radio frequency signal;
• and a stacked filter assembly supported by the package substrate, the stacked filter assembly coupled to the front end integrated circuit, the stacked filter assembly including a first surface mount device and a second surface mount device, and the second surface mount device stacked over at least part of the first surface mount device;
• and
• other components on the system board.