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US 2025/0158313 A1Published application
High density electrical connectors
AssigneeFci USA LLC
InventorsAymeric Soudy, Cyril Jeune
Life of this patent
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AssigneeFci USA LLC
InventorsAymeric Soudy, Cyril Jeune
Estimating the term…
In various embodiments, compact connector designs may be provided that have reduced board pitch (e.g., 1.80 mm, 1.50 mm, 1.27 mm, etc.), but are still capable of accommodating large electrical conductors (e.g., 1.4 mm, 1.1 mm, 0.9 mm, etc.). In this manner, PCB footprint may be reduced (e.g., by 50% when a staggered connector configuration is used), while adequate current carrying capacity may be maintained (e.g., 2 A, 3 A, 4 A, etc.). Additionally, or alternatively, one or more other advantages may be achieved, such as ruggedness (e.g., vibration endurance), error proofing, configuration flexibility, ease of manufacturing, ease of assembly, and/or lowered costs.
A first electrical connector, comprising:
An interconnect comprising:
An electrical connector configured to mate with a mating connector, the electrical connector comprising:
Dependencies are inferred from the claim text.