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US 2025/0158007 A1Published application
Method of manufacturing a package-on-package type semiconductor package
AssigneeAmkor Technology Singapore Holding Pte. Ltd.
InventorsDong Jin Kim, Jin Han Kim, Se Woong Cha, Ji Hun Lee, Joon Dong Kim, Yeong Beom Ko
Life of this patent
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Abstract
A method for manufacturing a semiconductor package, for example a package-on-package type semiconductor device package. As non-limiting examples, various aspects of this disclosure provide high-yield methods for manufacturing a package-on-package type semiconductor package, or a portion thereof.
Claims20
A method of manufacturing a semiconductor package, the method comprising:
- attaching an array of known-good package substrates to a carrier;
- attaching a respective known-good semiconductor die to a respective top surface of each package substrate of the array of package substrates;
- forming a respective stacking terminal attached to a respective perimeter region of each package substrate of the array of package substrates and outside a footprint of the respective attached semiconductor die;
- encapsulating the array of package substrates, the semiconductor dies, and the stacking terminals in an encapsulating material;
- thinning the encapsulating material to expose a respective upper end of each of the stacking terminals;
- forming a respective interposer for each package substrate of the array of package substrates on an upper surface of the encapsulating material and electrically connected to the respective stacking terminal;
- removing the encapsulated package substrates, semiconductor dies, and stacking terminals from the carrier;
- and
- attaching a respective interconnection structure to each of the encapsulated package substrates on a side opposite the respective semiconductor die.
6 more elements
A method of manufacturing a semiconductor package, the method comprising:
- attaching an array of known-good package substrates to a carrier, a respective bottom surface of each of the package substrates attached to a top surface of the carrier;
- for each of the package substrates:
- attaching a known-good semiconductor die to a top surface of the package substrate;
- and
- attaching a stacking terminal to the package substrate outside of a perimeter of the semiconductor die;
- encapsulating the array of package substrates, the semiconductor dies, and the stacking terminals in an encapsulating material;
- and
- singulating the encapsulated package structures.
5 more elements
A method of manufacturing a semiconductor package, the method comprising:
- attaching a bottom surface of a first known-good package substrate to a carrier;
- attaching a bottom surface of a second known-good package substrate to the carrier at a location laterally adjacent to the first known-good package;
- attaching a first semiconductor die to a top surface of the first package substrate;
- attaching a second semiconductor die to a top surface of the second package substrate;
- attaching a first interconnection structure to the top surface of the first package substrate outside a perimeter of the first semiconductor die;
- attaching a second interconnection structure to the top surface of the second package substrate outside a perimeter of the second semiconductor die;
- encapsulating the first package substrate, the first semiconductor die, the first interconnection structure, the second package substrate, the second semiconductor die, and the second interconnection structure in an encapsulating material;
- forming a first interposer on the first semiconductor die and on the encapsulating material, the first interposer electrically connected to the first interconnection structure;
- forming a second interposer on the second semiconductor die and on the encapsulating material, the second interposer electrically connected to the second interconnection structure;
- removing the encapsulated first package substrate, first semiconductor die, first interconnection structure, second package substrate, second semiconductor die, and second interconnection structure from the carrier;
- and
- separating the encapsulated first package substrate, first semiconductor die, and first interconnection structure from the encapsulated second package substrate, second semiconductor die, and second interconnection structure.
9 more elements
Dependencies are inferred from the claim text.