Method for manufacturing semiconductor device with substrate for electrical connection

A method for manufacturing a semiconductor device, comprising:

• providing a substrate having a lower surface and an upper surface opposite to the lower surface;
• disposing a first electronic component the upper surface of the substrate, wherein an active surface of the first electronic component faces the upper surface of the substrate;
• forming a bonding wire electrically connecting the first electronic component and the substrate, wherein the bonding wire extending within the substrate;
• disposing a second electronic component the upper surface of the substrate, wherein the second electronic component has an active surface facing the substrate;
• and
• forming an encapsulant the upper surface of the substrate, wherein the encapsulant extends within the substrate and encapsulates the bonding wire;
• wherein the bonding wire passes through the substrate and electrically connects the substrate and one of the first electronic component or the second electronic component.