Method of forming semiconductor package
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Chun-Hui Yu, Kuo-Chung Yee, Liang-Ju Yen
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Abstract
A method of forming a semiconductor package includes the following steps. A first die and at least one silicon block are provided, wherein the at least one silicon block has an adhesive on a first surface. A first encapsulating material is formed, to encapsulate the first die and the at least one silicon block. A planarization process is performed on the first encapsulating material, wherein a second surface opposite to the first surface of the at least one silicon block is coplanar with a top surface of the first encapsulant.
Claims20
A method of forming a semiconductor package, comprising:
- providing a first die and at least one silicon block, wherein the at least one silicon block has an adhesive on a first surface;
- forming a first encapsulating material, to encapsulate the first die and the at least one silicon block;
- and
- performing a planarization process on the first encapsulating material, wherein a second surface opposite to the first surface of the at least one silicon block is coplanar with a top surface of the first encapsulant.
A method of forming a semiconductor package, comprising:
- providing a first die having a bottom surface, a top surface and a sidewall between the bottom surface and the top surface;
- disposing at least one semiconductor block comprising a semiconductor material aside the sidewall of the first die, wherein the at least one semiconductor block is free of active device and passive device and has an adhesive on a bottom surface of the at least one semiconductor block;
- and
- forming an encapsulant, to encapsulate opposite sidewalls of the at least one semiconductor block.
A method of forming a semiconductor package, comprising:
- forming at least one first heat conduction block aside a first die, wherein the at least one first heat conduction block is free of active device and passive device;
- and
- adhering at least one second heat conduction block onto the at least one first heat conduction block through an adhesive.
Dependencies are inferred from the claim text.