Vertical semiconductor package including horizontally stacked dies and methods of forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJen-Yuan CHANG, Chia-Ping LAI
Life of this patent
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Abstract
A semiconductor package includes a first connection die including a semiconductor substrate and an interconnect structure, and a first die stack disposed on the first connection die and including stacked dies, each of the stacked dies including a semiconductor substrate and an interconnect structure including a first connection line that is electrically connected to the interconnect structure of the first connection die. An angle formed between a plane of the first connection die and a plane of each stacked die ranges from about 45° to about 90°.
Claims20
A semiconductor package comprising:
- a first connection die comprising a first connection die substrate having a first connection die front side and an opposing first connection die back side that defines a plane of the first connection die, and a first connection die interconnect structure disposed on the first connection die front side;
- a second connection die comprising a second connection die substrate having a second connection die front side and an opposing second die backside that defines a plane of the second connection die, and a second connection die interconnect structure disposed on the second connection die front side;
- and
- a first die stack having a first side that is bonded to the first connection die and an opposing second side that is bonded to the second connection die,
- wherein the plane of the first connection die is parallel to the plane of the second connection die.
A semiconductor package comprising:
- a first connection die comprising a first connection die substrate having a first connection die front side and an opposing first connection die backside that defines a plane of the first connection die, and a first connection die interconnect structure disposed on the first connection die front side;
- a second connection die comprising a second connection die substrate having a second connection die front side and an opposing second die backside that defines a plane of the second connection die, and a second connection die interconnect structure disposed on the second connection die front side;
- and
- a first die stack having a first side that is bonded to the first connection die and an opposing second side that is bonded to the second connection die, the first die stack comprising first dies that are stacked together in a first stacking direction that is parallel to the planes of the first connection die and the second connection die.
A semiconductor package comprising:
- a first connection die comprising a first connection die substrate having a first connection die front side and an opposing first connection die backside that defines a plane of the first connection die, and a first connection die interconnect structure disposed on the first connection die front side;
- a first die stack that is bonded to the first connection die, the first die stack comprising first dies that are stacked together in a first stacking direction that is parallel to the plane of the first connection die;
- and
- a second die stack that is bonded to the first connection die, the second die stack comprising second dies that are stacked together in a second stacking direction that is perpendicular to the plane of the first connection die.
Dependencies are inferred from the claim text.