Back to results
US 2025/0157992 A1Published application
Correction die for wafer/die stack
AssigneeAdeia Semiconductor Technologies LLC
InventorBelgacem Haba
Life of this patent
Estimating the term…
Abstract
Representative implementations of devices and techniques provide correction for a defective die in a wafer-to-wafer stack or a die stack. A correction die is coupled to a die of the stack with the defective die. The correction die electrically replaces the defective die. Optionally, a dummy die can be coupled to other die stacks of a wafer-to-wafer stack to adjust a height of the stacks.
Claims21
1-20. (canceled)
A microelectronic assembly, comprising:
- a plurality of dies coupled in a plurality of vertical three dimensional (3D) die stacks via a bonding technique that includes direct insulator-to-insulator bonding and direct metal-to-metal bonding,
- a quantity of the dies of each die stack preselected to include at least one additional die more than required for a predetermined functionality of the die stack, and
- at least one die of each die stack being a substitute die communicatively coupled to one or more dies in each respective die stack and at least one of the dies in at least one of the die stacks of the plurality of die stacks being an interchangeable die substitutable with the substitute die.
A microelectronic arrangement, comprising:
- a plurality of semiconductor wafers coupled in a wafer-to-wafer stack via a bonding technique that includes direct insulator-to-insulator bonding and direct metal-to-metal bonding,
- each semiconductor wafer including a plurality of dies, the plurality of wafers aligned such that the plurality of dies of each wafer couple to form a plurality of die stacks, each die stack aligned along an axis generally transverse to a plane of at least one of the wafers,
- wherein one or more of the plurality of die stacks of the plurality of wafers includes an interchangeable die;
- and
- a substitute die communicatively coupled to a die of each of the one or more die stacks that includes the interchangeable die, wherein the interchangeable die is substitutable with the substitute die.
2 more elements
Dependencies are inferred from the claim text.