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AssigneeSTMicroelectronics International N.V.
InventorsGuendalina CATALANO, Oscar DI MAURO
Estimating the term…
A semiconductor die is arranged at a mounting surface of a substrate via electrically conductive pillars protruding from the semiconductor die with distal ends of the electrically conductive pillars in electrical contact with the mounting surface of the substrate. The substrate has, at the mounting surface, two or more alignment bushings configured to have inserted therein respective electrically conductive pillars. Selected ones of the electrically conductive pillars protruding from the semiconductor die are inserted into the two or more alignment bushings at the mounting surface of the substrate. The pillars inserted into the alignment bushings counter movement of the semiconductor die with respect to the substrate.
A method, comprising:
A leadframe configured to have a semiconductor die arranged at a mounting surface of the leadframe via electrically conductive pillars protruding from the semiconductor die with distal ends of the electrically conductive pillars in electrical contact with the mounting surface of the leadframe, wherein the leadframe has at said mounting surface at least two alignment bushings configured to have respective electrically conductive pillars of the semiconductor die inserted therein to counter movement of the semiconductor die with respect to the leadframe.
Dependencies are inferred from the claim text.