Film-like adhesive and method for producing same, integrated dicing/die bonding film, and semiconductor device and method for producing same

Abstract

A film-like adhesive contains an epoxy resin, a phenolic resin, an elastomer, and an inorganic filler. A ratio of an epoxy group of the epoxy resin with respect to a hydroxyl group of the phenolic resin is 1.2 or more. A method for producing a film-like adhesive includes applying a varnish of a bonding adhesive composition comprising an epoxy resin, a phenolic resin, an elastomer, an inorganic filler, and a solvent to a support film and removing the solvent from the applied varnish by heating and drying to obtain a film-like adhesive.

Dependencies are inferred from the claim text.