Self-healing solder interconnection

A method of manufacturing a solder ball, comprising:

• forming an outer layer comprising a first conductive material that is solid at an operating temperature of an electronic device, wherein the outer layer surrounds an inner region;
• introducing a hole into the outer layer;
• injecting a second conductive material through the hole of the outer layer into the inner region, wherein the second conductive material flows at the operating temperature of the electronic device;
• and
• sealing the hole of the outer layer such that the second conductive material is retained within the inner region.

A method of manufacturing an electronic device, comprising:

• placing a plurality of solder balls, each at a respective contact point on a printed circuit board (PCB) of the electronic device, wherein each of the plurality of solder balls comprises:
• an outer layer comprising a first conductive material that is solid at an operating temperature of the electronic device, and
• an inner region comprising a second conductive material that flows at the operating temperature of the electronic device,
• wherein the inner region is surrounded by the outer layer;
• placing a plurality of electronic components in position proximate to the PCB, wherein each electronic component is in contact with one or more of the solder balls,
• applying heat to the plurality of solder balls such that each outer layer melts in part to form an electrical bond with the respective contact point and with one of the electronic components;
• and
• allowing the outer layer of each solder ball to cool.