Microelectronic assemblies having topside power delivery structures

A microelectronic assembly, comprising:

• a circuit board;
• a package substrate, having a first surface and an opposing second surface, on the circuit board and including a first conductive pathway electrically coupled to the circuit board;
• a first microelectronic component, having a first surface and an opposing second surface, embedded in a mold material on the second surface of the package substrate;
• a second microelectronic component embedded in the mold material;
• a through-mold via (TMV), between the first and second microelectronic components, extending through the mold material and electrically coupled to the first conductive pathway;
• a redistribution layer (RDL), having a first surface and an opposing second surface, on the mold material with the first surface facing the mold material, including a second conductive pathway electrically coupled to the TMV;
• and
• a third microelectronic component at the second surface of the RDL and electrically coupled to the second conductive pathway, wherein the second conductive pathway electrically couples the TMV, the third microelectronic component, and the second surface of the first microelectronic component.

A microelectronic assembly, comprising:

• a package substrate, having a surface, including a first conductive pathway;
• a first microelectronic component, having a first surface and an opposing second surface, embedded in a mold material on the second surface of the package substrate;
• a through-mold via (TMV), adjacent to the first microelectronic component, extending through the mold material and electrically coupled to the first conductive pathway;
• a redistribution layer (RDL), having a first surface and an opposing second surface, on the mold material with the first surface facing the mold material, including a second conductive pathway electrically coupled to the TMV;
• a second microelectronic component at the second surface of the RDL and electrically coupled to the second conductive pathway, wherein the second conductive pathway electrically couples the TMV, the second microelectronic component, and the second surface of the first microelectronic component;
• and
• a third microelectronic component at the second surface of the RDL and electrically coupled to the second conductive pathway.