Electronic devices comprising a compressive dielectric material

An electronic device, comprising:

• a stack structure comprising:
• at least one deck comprising tiers of vertically alternating dielectric materials and conductive materials;
• a compressive dielectric material on sidewalls of the tiers and on a base material adjacent to the tiers, a thickness of the compressive dielectric material on the base material relatively greater than a thickness of the compressive dielectric material on the sidewalls of the tiers;
• and
• a dielectric material extending between opposing sidewalls of the compressive dielectric material, the compressive dielectric material exhibiting a compressive force on the tiers.

An electronic device, comprising:

• a stack structure comprising:
• one or more decks comprising tiers of vertically alternating dielectric materials and conductive materials;
• a compressive dielectric material laterally adjacent to a lower portion of the tiers and in direct contact with the tiers, the dielectric material configured to exert a compressive force against the tiers;
• and
• a dielectric material contacting the compressive dielectric material and comprising a seam extending partially into the dielectric material.