Semiconductor device and method for manufacturing the semiconductor device
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorsJunichi KOEZUKA, Toshimitsu OBONAI, Masami JINTYOU, Daisuke KUROSAKI
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AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorsJunichi KOEZUKA, Toshimitsu OBONAI, Masami JINTYOU, Daisuke KUROSAKI
Estimating the term…
A semiconductor device having favorable electrical characteristics is provided. A semiconductor device having stable electrical characteristics is provided. A highly reliable semiconductor device is provided. The semiconductor device includes a semiconductor layer, a first insulating layer, and a first conductive layer. The semiconductor layer includes an island-shaped top surface. The first insulating layer is provided in contact with a top surface and a side surface of the semiconductor layer. The first conductive layer is positioned over the first insulating layer and includes a portion overlapping with the semiconductor layer. In addition, the semiconductor layer includes a metal oxide, and the first insulating layer includes an oxide. The semiconductor layer includes a first region overlapping with the first conductive layer and a second region not overlapping with the first conductive layer. The first insulating layer includes a third region overlapping with the first conductive layer and a fourth region not overlapping with the first conductive layer. Furthermore, the second region and the fourth region contain phosphorus or boron.
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A method for manufacturing a semiconductor device comprising a transistor, comprising the steps of:
Dependencies are inferred from the claim text.