Apparatuses including ball grid arrays and associated systems

A system, comprising:

• a central processing unit (CPU), a graphics processing unit (GPU), or a field programmable gate array (FPGA), or any combination thereof;
• and
• at least one memory device connected to the CPU, the GPU, or the FPGA, the at least one memory device comprising:
• a device substrate comprising a microelectronic device and bond pads coupled with an active surface of the device substrate;
• a package substrate secured to the device substrate, the package substrate configured to route signals to and from the bond pads;
• and
• a ball grid array supported on, and electrically connected to, the package substrate;
• wherein each ball of the ball grid array positioned and configured to carry one of a high-bandwidth data signal or a high-frequency clock signal is located laterally or longitudinally adjacent to no more than two other balls of the ball grid array configured to carry another of a high-bandwidth data signal or a high-frequency clock signal.