Semiconductor package including trench structure, manufacturing method thereof, and strip substrate

A method for manufacturing a semiconductor package, comprising:

• forming a strip substrate that has a package region and a package separation region surrounding the package region and that includes a plurality of trenches disposed at an edge of the package region of a bottom surface;
• mounting a semiconductor chip on the package region of a top surface of the strip substrate;
• sealing the semiconductor chip with an encapsulation part;
• forming an individualized semiconductor package by cutting the encapsulation part and the strip substrate along the package separation region through a sawing process;
• inspecting an appearance of trenches of the semiconductor package;
• evaluating a capability of the sawing process based on a result of the inspecting of the appearance of the trenches;
• and
• forming a shield layer on a side surface of a package substrate of the semiconductor package and a surface of the encapsulation part,
• wherein each of the plurality of trenches of the strip substrate includes first and second regions that are continuously disposed in a direction that is perpendicular to a direction in which a portion of the package separation region that contacts the corresponding trench extends,
• wherein the first and second regions have different widths, and
• wherein the inspecting of the appearance of the trenches includes checking a presence of the first and second regions of the trenches of the semiconductor package.