Electronic device and manufacturing method thereof

A manufacturing method of an electronic device, comprising:

• providing a first substrate, the first substrate having a first surface, a second surface opposite the first surface, a side surface between the first surface and the second surface, and a chamfer surface between the second surface and the side surface;
• forming a first wire on the first surface;
• forming a second wire on the second surface;
• forming a conductive layer on the side surface, the chamfer surface and the second surface;
• and
• patterning the conductive layer to form a side wire, wherein the side wire is electrically connected to the first wire and the second wire,
• wherein a first portion of the side wire on the side surface has a first width W1, a second portion of the side wire on the chamfer surface has a second width W2, the second wire has a third width W3, and the second width W2 is less than or equal to the third width W3.