Semiconductor device

A semiconductor device comprising:

• a plurality of semiconductor chips stacked in a vertical direction, the plurality of semiconductor chips including a plurality of cooling channels respectively recessed in the plurality of semiconductor chips from upper surfaces of the plurality of semiconductor chips, the plurality of cooling channels configured to have a coolant flow in a liquid phase therein such as to absorb heat generated during an operation of the plurality of semiconductor chips;
• a plurality of first wick structures on bottoms of the plurality of cooling channels that are respectively parallel to the upper surfaces of the plurality of semiconductor chips in a transverse direction, the plurality of first wick structures configured to move the coolant by capillary action in the transverse direction along the bottoms of the plurality of cooling channels;
• a vapor chamber above an uppermost semiconductor chip among the plurality of semiconductor chips, the vapor chamber being in fluid communication with the plurality of cooling channels;
• second wick structures on an inner surface of the vapor chamber and configured to move the coolant by capillary action in the transverse direction along the inner surface of the vapor chamber;
• a connection channel penetrating the plurality of semiconductor chips except for lowermost semiconductor chip among the plurality of semiconductor chips;
• third wick structures between the second wick structures and first wick structures, among the plurality of first wick structures, that are arranged on the uppermost semiconductor chip among the plurality of semiconductor chips, the third wick structures configured to move the coolant in the liquid phase by capillary action from the second wick structures to the first wick structures;
• and
• at least one fourth wick structure configured to move the coolant in the liquid phase by capillary action along the connection channel from the second wick structures to at least one of the plurality of first wick structures.