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US 2025/0157808 A1Published application
Methods and apparatus utilizing indium-based precursors for integrated circuit manufacturing
AssigneeIntel Corporation
InventorsCharles Mokhtarzadeh, Scott Semproni, Scott B. Clendenning
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Abstract
Methods and apparatus utilizing indium-based precursors in semiconductor manufacturing are disclosed. An example apparatus includes a substrate layer, the substrate layer to be included an integrated circuit package, and a photoresist on the substrate layer, the photoresist including indium.
Claims20
An apparatus comprising:
- a substrate layer, the substrate layer to be included in an integrated circuit package;
- and
- a photoresist on the substrate layer, the photoresist including indium.
An apparatus comprising:
- a substrate layer;
- and
- a photoresist layer coated on the substrate layer, the photoresist layer including a plurality of molecular clusters, the molecular clusters including indium and oxygen.
A method comprising:
- depositing indium-based molecular clusters on a substrate, the substrate to be included in an integrated circuit package;
- exposing a first portion of the indium-based molecular clusters to light using a photomask;
- and
- removing the first portion or a second portion of the indium-based molecular clusters to partially expose the substrate, the second portion not exposed to the light.
1 more element
Dependencies are inferred from the claim text.