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US 2025/0157797 A1Published application
Placing table and substrate processing apparatus
AssigneeTokyo Electron Limited
InventorsKatsuyuki KOIZUMI, Masanori TAKAHASHI, Shota EZAKI
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Abstract
A placing table includes a first surface located at an outer side than a substrate; and a second surface on which the substrate is placed. A first path is formed to correspond to the first surface.
Claims15
A placing table comprising a first surface located at an outer side than a substrate;
- and a second surface on which the substrate is placed,
- wherein a first path is formed to correspond to the first surface.
A substrate processing apparatus comprising a chamber configured to perform a plasma processing or a heat treatment therein;
- and a placing table configured to place a substrate on an electrostatic chuck within the chamber,
- wherein the placing table comprises:
- a first surface located at an outer side than the substrate;
- and
- a second surface on which the substrate is placed,
- wherein a first path is formed to correspond to the first surface.
3 more elements
Dependencies are inferred from the claim text.