Electrostatic chuck, method of manufacturing electrostatic chuck, and plasma processing apparatus

A method of manufacturing an electrostatic chuck configured to support a substrate and to receive a lift pin so that the lift pin is ascendable and descendable therein and comprising at least one pin hole formed vertically therethrough to allow the lift pin to ascend and descend along the at least one pin hole, the method comprising:

• forming a bonding layer on an upper surface of a base plate;
• bonding an upper insulating pipe to an inner side wall of the at least one pin hole in a ceramic puck configured to allow the substrate to be seated thereon;
• adhering the ceramic puck to an upper side of the bonding layer so that the upper insulating pipe is inserted into the at least one pin hole in the base plate;
• and
• adhering a lower insulating pipe to a lower side of the upper insulating pipe and the base plate.

A plasma processing apparatus comprising:

• a chamber comprising a plasma processing space for a substrate defined therein;
• an electrostatic chuck configured to support the substrate and to receive a lift pin so that the lift pin is ascendable and descendable therein;
• an upper electrode configured to generate plasma in the plasma processing space;
• a window configured to isolate the upper electrode from the plasma processing space;
• a power supply configured to supply power to the upper electrode;
• a gas supply member configured to supply a process gas to the plasma processing space;
• and
• a gas source configured to supply the process gas to the gas supply member,
• wherein the electrostatic chuck comprises:
• at least one pin hole to allow the lift pin to vertically ascend and descend along the at least one pin hole;
• a ceramic puck configured to allow the substrate to be seated thereon;
• a base plate configured to support the ceramic puck;
• a bonding layer configured to bond the ceramic puck to the base plate;
• and
• an insulating pipe mounted on an inner side wall of the at least one pin hole in the ceramic puck,
• wherein the at least one pin hole vertically penetrates the ceramic puck, the base plate, and the bonding layer, and
• wherein the insulating pipe comprises:
• an upper insulating pipe bonded to the ceramic puck;
• and
• a lower insulating pipe adhered to the base plate, and
• wherein the upper insulating pipe comprises:
• a bonding portion brazed to the inner side wall of the at least one pin hole in the ceramic puck;
• a protruding portion protruding outward from a lower side of the bonding portion so as to be attached to the bonding layer;
• and
• a body portion extending downward from a lower side of the protruding portion and having a smaller diameter than the protruding portion.